Patterning method for semiconductor device fabrication

ABSTRACT

A method includes forming a first pattern having a first opening on a semiconductor substrate. The first opening is then filled. A second pattern of a first and second feature, interposed by the filled opening, is formed on the semiconductor substrate. Spacer elements then are formed on sidewalls of the filled opening, the first feature and the second feature. After forming the spacer elements, the material comprising first and second features is removed to form a second opening and a third opening. The filled opening, the second opening and the third opening are used as a masking element to etch a target layer of the substrate.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and designs have producedgenerations of ICs each having smaller and more complex circuits. In thecourse of IC evaluation, the geometry size or technology node (e.g.,smallest component or line that can be imaged) has decreased. Shrinkingtechnology nodes generally provide benefits by increasing productionefficiency and lowering costs. However, these advances have alsoincreased the complexity of fabricating of the circuits. For example,the scaling-down feature sizes can lead to fabrication challenges suchas meeting process overlay margins. As the technology nodes shrink, theprocess overlay margins also shrink—and become more and more critical.One such process where the layout of the device demands alignment ofclosely-spaced features is in the fabrication of interconnect structuresfor the IC device. Thus, advances in IC fabrication are also needed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is an embodiment of a method of fabricating a pattern of featuresof a semiconductor device according to one or more aspects of thepresent disclosure.

FIGS. 2-10, 12, 13 a, and 14 illustrate perspective views of anembodiment of a device fabricated according to one or more steps of themethod of FIG. 1. FIGS. 11 and 13 b illustrate corresponding top viewsof the substrate.

FIG. 15 illustrates an embodiment of a top view of a layout of asemiconductor device formed according to one or more aspects of thepresent disclosure.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof the invention. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Moreover,the formation of a first feature over or on a second feature in thedescription that follows may include embodiments in which the first andsecond features are formed in direct contact, and may also includeembodiments in which additional features may be formed interposing thefirst and second features, such that the first and second features maynot be in direct contact. Various features may be arbitrarily drawn indifferent scales for simplicity and clarity. Further, while the presentdisclosure may present embodiments directed to semiconductor device suchas integrated circuits (ICs), one would appreciate that various devicesand processes may benefit from the present disclosure including, forexample, image sensors, thin film transistor liquid crystal displays(TFT-LCDs), light emitting diodes (LEDs), photomasks, and/or othersuitable devices.

Illustrated in FIG. 1 is a method 100 of fabricating a pattern offeatures of a semiconductor device on a substrate. In an embodiment, thepattern of features may be used to form features of an interconnectstructure such as a multi-layer interconnect (MLI) structures. Forexample, the patterns defined by FIG. 1 may be used to form a layer ofan MLI structure.

FIGS. 2-14 are perspective views of an exemplary embodiment of a devicefabricated according to the method 100 of FIG. 1.

It is understood that the method 100 includes steps having features of acomplementary metal-oxide-semiconductor (CMOS) technology process flowand thus, are only described briefly herein. Additional steps may beperformed before, after, and/or during the method 100.

It is also understood that parts of the semiconductor device of FIGS.2-15 may be fabricated by complementary metal-oxide-semiconductor (CMOS)technology process flow, and thus some processes are only brieflydescribed herein. Further, the semiconductor device may include variousother devices and features, such as additional transistors, bipolarjunction transistors, resistors, capacitors, diodes, fuses, etc., but issimplified for a better understanding of the inventive concepts of thepresent disclosure. Furthermore, the device of FIGS. 2-15 may be anintermediate device fabricated during processing of an integratedcircuit, or portion thereof, that may comprise static random accessmemory (SRAM) and/or other logic circuits, passive components such asresistors, capacitors, and inductors, and active components such asP-channel field effect transistors (PFET), N-channel FET (NFET),metal-oxide semiconductor field effect transistors (MOSFET),complementary metal-oxide semiconductor (CMOS) transistors, bipolartransistors, high voltage transistors, high frequency transistors, othermemory cells, and combinations thereof.

The semiconductor device of FIGS. 2-15 includes a plurality ofsemiconductor devices (e.g., transistors), which may be interconnected.The devices may be interconnected using an interconnect structure formedaccording the method 100. The interconnect structure may provide aphysical and/or electrical connection between devices and/or between adevice and a pad providing an external connection (e.g., to a package).An interconnect structure such as an MLI structure includes a pluralityof conductive lines formed in various layers (e.g., metal 1, metal 2)with conductive vias interconnecting the lines. Dielectric material isprovided in the interconnect structure, for example, interlayerdielectric (ILD) layers to provide isolation between conductivefeatures.

With reference now to FIG. 1, the method 100 begins at block 102 where asubstrate is provided. The substrate includes a plurality of layers. Thesubstrate may include a semiconductor wafer having a plurality of layersformed thereon. In an embodiment, the semiconductor wafer is silicon.Alternatively, the substrate may comprise another elementarysemiconductor, such as germanium; a compound semiconductor includingsilicon carbide, gallium arsenic, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductorincluding SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; orcombinations thereof. In yet another alternative, the substrate is asemiconductor on insulator (SOI). Alternatively, the substrate mayinclude a non-semiconductor material such as a glass substrate, fusedquartz substrate, and/or other suitable materials.

The substrate may include various features such as doped regions,dielectric features, conductive features such as multi-layerinterconnects, and/or other suitable features. In one embodiment, thesubstrate includes features forming various semiconductor devices suchas, for example, complementary metal-oxide-semiconductor field effecttransistors (CMOSFET), imaging sensors, capacitors, memory cells,diodes, fin-type field-effect transistors (FINFETs), and/or othersuitable devices.

Referring to the example of FIG. 2, a substrate 200 is provided. Thesubstrate 200 illustrates a substrate 200 having a plurality of layersformed thereon. As illustrated, substrate 200 includes base layers 202,204, and 206; target layer 208; and anti-reflective layer 210. However,these layers are exemplary and not intended to be limiting; one or moreof the layers may be omitted, and additional layers may be added.Exemplary compositions for the layers formed on the substrate 200 areprovided below, however, except as specifically defined by the claimshereto, these compositions are merely exemplary and not intended to belimiting.

In an embodiment, the base layer 202 includes silicon carbide. Otherexemplary materials include other suitable etch stop materials such assilicon nitride. In an embodiment, base layer 204 includes a dielectricmaterial such as a low-k or an extreme low-k dielectric material.Exemplary ELK materials include dielectric materials having a dielectricconstant k less than approximately 2. The base layer 204 layer mayinclude dielectric materials such as, tetraethylorthosilicate (TEOS)oxide, un-doped silicate glass, or doped silicon oxide such asborophosphosilicate glass (BPSG), fused silica glass (FSG),phosphosilicate glass (PSG), boron doped silicon glass (BSG), and/orother suitable dielectric materials. The layer may be deposited by aPECVD process or other suitable deposition technique. In an embodiment,the base layer 204 may be an interlayer dielectric (ILD) layer of a MLIstructure.

In an embodiment, the base layer 206 includes a dielectric material suchas tetraethyl orthosilicate (TEOS). Other exemplary compositions includeun-doped silicate glass, or doped silicon oxide such asborophosphosilicate glass (BPSG), fused silica glass (FSG),phosphosilicate glass (PSG), boron doped silicon glass (BSG), and/orother suitable dielectric materials. In an embodiment, the target layer208 includes a hard mask material. In one embodiment, the target layer208 is TiN. In an embodiment, the anti-reflective layer 210 includes anitrogen-free antireflective layer (NFARL).

The layers 202, 204, 206, 208, and/or 210 may be formed by suitableprocesses such as, for example, chemical vapor deposition (CVD)including plasma-enhanced CVD (PECVD), low-pressure CVD (LPCVD), orHDP-CVD process; spin-on coating; sputtering; physical vapor deposition(PVD); atomic layer deposition (ALD); and/or other suitable processes.

The method 100 then proceeds to block 104 where a first pattern maskingelement is formed on the substrate. The first pattern masking elementmay include a photoresist layer patterned to form one or more openings.The opening(s) may define a space between adjacent interconnect features(e.g., lines or vias).

Referring to the example of FIG. 3, a tri-layer resist stack 302 isdisposed on the substrate 200. The tri-layer resist stack 302 includesan underlayer 304, a middle layer 306 and an upper layer 308. The upperlayer 308 may be a photosensitive resist material such as a 193-nmresist. The middle layer 306 may have a composition operable to providea hard mask, used to transfer the pattern of upper layer 308 to theunderlying layer 304. The underlying layer 304 may have a compositionthat suitable for patterning by the middle layer 306 and/or hasanti-reflective properties. In an embodiment, the upper layer 308 ispatterned using suitable lithography techniques. The pattern provides anopening 310. The pattern (opening 310) may also be referred to as a “cutpattern”. The pattern also provides a regions 312 adjacent and spaced adistance from the opening 310. The regions 312 are also openings/gaps inthe layer 308.

The method 100 then proceeds to block 106 where an etching process isperformed to transfer the pattern defined by the first masking elementto an underlying layer. The transferred pattern provides a first patternof features. The first pattern of features may define regions betweeninterconnect features (e.g., lines or vias), as described below. Thepattern may be transferred using suitable etching processes such as dryetch, plasma etch, and/or wet etch.

Referring to the example of FIG. 4, the pattern including opening 310and regions 312 defined in the upper layer 308 of the tri-layer resiststack 302 is transferred to the layer 304.

(It is note that while a tri-layer resist stack is described herein, oneof ordinary skill in the art would recognize in other embodiments, othermaterials may be used to provide the same result for features defined onthe layer 210 such as, for example, using a single layer or bilayerresist.) After transferring the first pattern defined in the upper layer308 (FIG. 3), the upper layer 308 and/or middle layer 306 may bestripped from the substrate 200.

The method 100 then proceeds to block 108 where a fill material isformed on the substrate. The fill material may fill the regions definedby the first pattern. For example, the fill material may fill theopening(s) and/or gaps defined by the first pattern. In an embodiment,the fill material is a silicon-containing antireflective coating(Si-ARC). Exemplary Si-ARCs include inorganic ARCs such as SiON, siliconcontaining organic ARCs such as polysilanes, and/or other suitablecompositions. In an embodiment, the silicon content is betweenapproximately 30 and 40 atomic weight percent. The fill material may beformed using a spin-coating or other suitable deposition process. Anetch back process may follow the deposition of the fill material, forexample, a chemical mechanical polish (CMP) process or suitable etchingprocess.

Referring to the example of FIG. 5, the openings (FIG. 4) are filledwith fill material. In an embodiment, the fill material 502 is Si-ARC.The fill material fills the opening 402 providing a filled openingdenoted 504. The fill material also fills the gaps 310 providing filledregions 502. After depositing a fill material, an etch back process orother planarization process (e.g., etch, chemical mechanical polish,etc.) may be performed to provide a surface of the fill material 502/504substantially coplanar with that of layer 304.

In an embodiment, the method 100 and block 108 further includesstripping the layer used to define the first pattern after forming thefill material. In an embodiment, this includes stripping a first (under)layer of a tri-layer resist. Referring to the example of FIG. 6, theremaining portions of layer 304 are removed from the substrate 200creating openings 602.

The method 100 then proceeds to block 110 where a masking element of asecond pattern is formed on the substrate. The second pattern mayinclude a plurality of features. For example, the second pattern mayinclude a plurality of features formed of photoresist. The photoresistmay include a tri-layer resist. The second pattern may defineinterconnect features (e.g., metal lines). Referring to the example ofFIG. 7, a tri-layer resist 702 is disposed on the substrate 200. Thetri-layer resist 702 includes an underlayer 704, a middle layer 706, andan upper layer 708. The upper layer 708 may be a photosensitive resistmaterial such as a 193-nm resist. The middle layer 706 may have acomposition operable to provide a hard mask, used to transfer thepattern of upper layer 708 to the underlying layer 704. The underlyinglayer 704 may have a composition that suitable for patterning by themiddle layer 706 and/or has anti-reflective properties. In anembodiment, the upper layer 708 is patterned using suitable lithographytechniques. As illustrated, the upper layer 708 is patterned to includea first and second feature; however, any number of features andconfigurations may be possible. In an embodiment, the second pattern 708includes photoresist features. The photoresist features may be formedusing suitable processes such as the formation of a layer of photoresist(e.g., spin-on coating, exposure to pattern, development of the exposedphotoresist, baking processes, and the like).

The method 100 then proceeds to block 112 where an etching process isperformed to transfer the pattern defined by the second masking elementto an underlying layer. The transferred pattern provides a secondpattern of features. The second pattern of features may defineinterconnect features (e.g., lines or vias), as described below. Thepattern may be transferred using suitable etching processes such as dryetch, plasma etch, and/or wet etch. After the pattern is transferred,the first pattern (described above with reference to block 106) and thesecond pattern (described here in block 112) are provided on a layer ofa device, in other words, the patterns are co-planar.

Referring to the example of FIG. 8, the pattern of features provided inlayer 708 are transferred to the underlayer 704 formed on the layer 210.The pattern features formed using the second masking element defined inlayer 708 (FIG. 7) are denoted as elements 802. (It is noted that whilea tri-layer resist stack is described herein, one of ordinary skill inthe art would recognize in other embodiments, other materials may beused to provide the same result for features defined on the layer 210such as, for example, single layer or bilayer resists.) Aftertransferring the second pattern defined in the upper layer 708 (FIG. 7),the upper layer 708 and/or middle layer 706 may be stripped from thesubstrate 200.

The method 100 then proceeds to block 114 where a conformal layer isformed on the substrate. The conformal layer may also be referred to asa spacer layer. The conformal layer may be a dielectric material.Exemplary materials include silicon dioxide, silicon nitride, siliconoxynitride, and/or other suitable materials. The conformal layer may beformed on the substrate including on the features defined by the firstand second patterns, described above. Referring to the example of FIG.9, a conformal or spacer material layer 902 is disposed on the substrate200 including on the feature 504 (including its four sidewalls) andfeatures 502 of the first pattern and the features 802 of the secondpattern (including each features two sidewalls).

The method 100 then continues to block 116 where the features defined bythe second pattern masking element are uncovered (e.g., the conformalspacer material removed from a top surface) and removed from thesubstrate. Referring to the example of FIG. 10, a material removalprocess is performed to remove the conformal material 902 from a topsurface of the features 802. The material removal process may include achemical mechanical polish (CMP) process, an etch-back process such as awet etch, dry etch, plasma etch, and/or other suitable process. The etchback process may provide a substantially coplanar surface of theelements 502, 504, 902, and 802.

Referring now to FIG. 11, illustrated is a top view of a portion of thesubstrate 200. The features 802 have a width A. The filled opening 504has a length L in a dimension interposing the features 802. Theconformal material (spacer material) 902 has a thickness S at a sidewallof a feature. The thickness S may be substantially similar on allsidewalls of the features (e.g., 802 and 504). The features 802 have apitch P.

Thus, when P is the second pattern feature pitch, A is the secondpattern width, L is the first pattern (cut pattern) length and S is thespacer thickness, the following relationships may be observed. In anembodiment, the critical dimension (CD) variation of the first patternis 2*S. In an embodiment, P−A−(4*S) is less than L. In a furtherembodiment, L may be less than P−A. The maximum overlay tolerance of thefirst pattern is S when L=P−A−(2*S). In an embodiment, P isapproximately 90 nanometers (nm).

Continuing with block 116, after exposing a top surface of the featuresof the second pattern, the features are removed from the substrate. Inan embodiment, the features of the second pattern are photoresist andare removed from the substrate using suitable stripping processes.Referring to the example of FIG. 12, the exposed features 802 (FIG. 10)are removed from the substrate 200. The removal of the features 802provides openings 1202 with sidewalls defined by the spacer material902.

The method 100 then proceeds to block 118 where the pattern istransferred to an underlying target layer(s). In an embodiment, thepattern is transferred to an underlying dielectric layer forming theisolation between interconnect features. In an embodiment, oneunderlying layer is a hard mask layer. Thus, the first (cut) pattern andsecond pattern define a single layer or level of the interconnectstructure (e.g., metal 1, metal 2). Referring to the example of FIG. 13a and the top view of FIG. 13 b, the openings 1202 (FIG. 12) are used asmasking elements to form openings 1304 in the hard mask layer 208. Theregions 502 and filled trench 504 and surrounding spacer layer 902 areused as masking elements to define openings 1306. The openings 1304 and1306 together define a pattern 1302 provided in the hard mask layer 208.The pattern 1302 defines a layer of an interconnect structure.

The method 100 may continue to include transferring the pattern (e.g.,1302) to additional layers. In an embodiment, the pattern 1302 is usedto define a conductive layer (e.g., metal line) of an interconnectstructure such as by a damascene or dual-damascene process. For example,the pattern defined by the method 100 (e.g., hard mask) may betransferred to an underlying layer by using the pattern as a maskingelement to etch trenches in a dielectric layer such as an interlayerdielectric (ILD). A conductive material may then be plated into thetrenches in the dielectric layer. In an embodiment, the conductivematerial formed in the trenches includes copper. However, otherexemplary embodiments include conductive materials such as aluminum,copper alloys, tungsten, and/or other suitable materials.

For example, using the example of FIG. 14, the pattern 1302 may betransferred to the base layer 204. In an embodiment, layer 204 is aninterlayer dielectric layer (ILD). The pattern may be transferred usingsuitable etching processes using the openings 1302 of the layer 208 asmasking element. The etching processes may include dry etch, wet etch orplasma etch processes. After forming the trenches in the layer 204, thetrenches are filled with conductive material providing an interconnectline 1402. It is noted that the features 1402 a of the interconnectfeature 1402 may be referred to as being defined by a second pattern andthe features 1402 b may be referred to as being defined by the firstpattern (as well as the second pattern). The features of 1402 may form aconductive line of an interconnect structure.

Thus, the method 100 may be used to form conductive lines of aninterconnect feature. In other embodiments, however, other features maybe defined using the steps of the method 100. For example, gatestructures, fin structures for fin-type field effect transistors, and/orvarious other features of semiconductor devices. Some embodiments of themethod 100 provide benefits such as an increase in the “cut” pattern(first pattern described above) critical dimension required and/or anincrease in the overlay margin between the first and second patterns.One reason for this improvement may be that the first pattern (a “cut”pattern) is processed prior to the second pattern. This combination offirst and second patterns allows for the spacer material deposition tobe done in a single process. One example benefit is that the spacingbetween the second and first pattern is occupied by a spacer material,thus, providing for improved tolerance (e.g., x-direction tolerance ofthe first pattern with respect to the second pattern) and/or an improvedoverlay tolerance between patterns.

Referring now to FIG. 15, illustrated is a layout 1500 of an IC device.A device associated with the layout 1500 may be fabricated using themethod 100, described above with reference to FIGS. 1-14.

The layout 1500 includes a pattern 1502. The pattern 1502 may be formedsubstantially similar to the second pattern described above withreference to block 110 of the method 100 (see also, FIG. 7 definingmasking element 708). The layout 1500 also includes a pattern 1504. Thepattern 1504 may be substantially similar to that formed by the firstmasking element described above in block 104 of the method 100 (seealso, FIG. 3 elements 310 and 312). The patterns 1502 and 1504 maydefine features of a metal layer of an interconnect structure, forexample, the first and second patterns 1502 and 1504 may defineconductive (e.g., copper) lines in one layer of a MLI of the device. Thelayout 1500 also includes a cut pattern 1506. The cut pattern 1506 maybe substantially similar to the pattern described above with referenceto block 104 of the method 100 and/or the pattern defined by opening 310of the FIG. 3. It is noted that the cut pattern 1506 interposes twofeatures of the pattern 1502 and defines a space in a feature of pattern1504.

In summary, the methods and devices disclosed herein provide for formingfeatures using a cut pattern. In doing so, one or more embodiments thepresent disclosure offers several advantages over prior art devices.Advantages of the present disclosure include providing a cut pattern(e.g., first pattern as described above) that has a larger CD and/oroverlay margin because it is advanced before the pattern defining thefeatures (e.g., interconnects). The cut pattern may also be formed usinga larger size thus easing the lithography requirements of forming thepattern. Another advantage is that the cut pattern is advancedsimultaneously with the patterning of the first pattern (e.g.,interconnect feature).

Thus, described herein is an embodiment of a method. The method includesforming a first pattern on a semiconductor substrate having a targetlayer. The first pattern includes a first opening. The first opening isthen filled with a fill material. A second pattern is formed on thesemiconductor substrate, which includes a first feature and a secondfeature. The filled opening interposes the first and second features.Spacer elements are formed on sidewalls of the filled opening, the firstfeature and the second feature. After forming the spacer elements, thematerial comprising first and second features is removed to form asecond opening and a third opening. The sidewalls of the second andthird openings are defined by the spacer elements. The filled opening,the second opening and the third opening are used as a masking elementto etch the target layer.

In a further embodiment, the first pattern also includes a fourth andfifth opening (see, e.g., FIG. 3 openings 312). The filling process mayfurther include filling these fourth and fifth openings. The first andsecond features lie adjacent and transverse the filled fourth and thefilled fifth opening.

In another further embodiment, the first and second features arephotoresist. In an embodiment, the target layer is formed by depositinga hard mask material on a dielectric layer on the semiconductorsubstrate. The first opening may be filled by depositing asilicon-containing antireflective coating (Si-ARC). In an embodiment,the first opening is formed by depositing a tri-layer photoresist stackand etching the first opening in an underlying layer of the tri-layerphotoresist stack. The spacer elements may then be formed on sidewallsof the filled opening, the first feature and the second feature.

In a further embodiment, forming the spacer elements includes forming aconformal layer of a dielectric material on the filled opening, thefirst feature and the second feature and then, removing the conformallayer from a top surface of each of the filled opening, the firstfeature and the second feature. In an embodiment, the filled opening,second opening and third opening are substantially coplanar. In afurther embodiment, the etched target layer is used to form a conductiveline of an interconnect structure.

In another of the broader embodiments of a method described herein, amethod of semiconductor device fabrication is provided. The methodincludes forming a first photoresist element on a substrate. The firstphotoresist element has an opening therein. The opening is filled. Thefirst photoresist element is then removed after filling the opening.Also after filling the opening, a second photoresist element and a thirdphotoresist element are formed adjacent to and coplanar with the filledopening. A spacer element is formed on sidewalls of the secondphotoresist element and the third photoresist element. After forming thespacer elements, the second and third photoresist elements are removed.The filled opening and the spacer elements are used as a masking elementto provide an interconnect layer of a semiconductor device.

In a further embodiment, the method includes using the filled openingand the spacer elements as masking elements to provide the interconnectlayer by etching a hardmask layer through openings provided by theremoval of the first and second photoresist elements and defined by thespacer elements. In an embodiment, spacer elements are also formed onsidewalls of the filled opening. The spacer elements may be disposed onfour sidewalls of the filled opening. In an embodiment, using the filledopening and the spacer elements to provide an interconnect layerincludes etching a hard mask layer.

In another of the broader forms of the methods described herein, amethod provides for forming a first feature on a layer of a substrateusing a first patterning process (see, e.g., FIG. 3 and the accompanyinglithography process). A second patterning process (see, e.g., FIG. 7 andthe accompanying lithography process) is then used to form a secondfeature and a third feature on the layer. A conformal layer is formedover the first, second, and third features. The conformal layer isetched back to expose a top surface of the first, second and thirdfeatures. The second and third features are removed after exposing thetop surface to form a first and second opening. Using the space, thefirst opening and the second opening, a trench (also referred to asopening) is formed in an underlying layer. The trenches are used topattern an interconnect structure of a semiconductor device.

In a further embodiment, the interconnect structure is a copper metalline. In an embodiment, the second and third features include aphotoresist material. Etching back the conformal layer can provide aplanar surface including the conformal layer, and each of the first,second and third features.

In another further embodiment, a fourth feature and a fifth feature areformed using the first patterning process. (see, e.g., FIG. 3) Thefourth feature is spaced a first distance from an end cap (e.g.,terminal end of rectangular feature) of the second feature and the fifthfeature is spaced a second distance from an end cap of the thirdfeature. The conformal layer may fill this first and second distance. Insome embodiments, the first feature, the fourth feature and the fifthfeature each have a composition including silicon (e.g., Si-ARC).

It is understood however that different embodiments disclosed hereinoffer different disclosure, and that they may make various changes,substitutions and alterations herein without departing from the spiritand scope of the present disclosure.

What is claimed is:
 1. A method, comprising: forming a first pattern ona semiconductor substrate having a target layer, wherein the firstpattern includes a first opening; filling the first opening with a fillmaterial, thereby forming a filled opening; forming a second pattern onthe semiconductor substrate, wherein the second pattern includes a firstfeature and a second feature, the filled opening interposing the firstand second features; forming a spacer elements on sidewalls of thefilled opening, the first feature, and the second feature; after formingthe spacer elements, removing material comprising first and secondfeatures to form a second opening and a third opening, wherein sidewallsof the second and third openings are defined by the spacer elements; andusing the filled opening, the second opening and the third opening as amasking element to etch the target layer.
 2. The method of claim 1,wherein forming the first pattern further includes forming fourth andfifth openings; wherein the filling further including filling the fourthand fifth openings to form a filled fourth opening and a filled fifthopening; and wherein the first and second features each are disposedadjacent to and transverse to the filled fourth and the filled fifthopening.
 3. The method of claim 1, wherein the forming the secondpattern includes forming the first and second features of photoresist.4. The method of claim 1, further comprising: forming the target layerby depositing a hard mask material on a dielectric layer on thesemiconductor substrate.
 5. The method of claim 1, wherein filling thefirst opening includes depositing a silicon-containing antireflectivecoating (Si-ARC).
 6. The method of claim 1, wherein forming the firstopening includes depositing a tri-layer photoresist stack and etchingthe first opening in an underlying layer of the tri-layer photoresiststack.
 7. The method of claim 6, wherein forming the spacer elements onsidewalls of the filled opening, the first feature and the secondfeature further comprising: forming a conformal layer of a dielectricmaterial on the filled opening, the first feature and the secondfeature; and removing the conformal layer from a top surface of each ofthe filled opening, the first feature and the second feature.
 8. Themethod of claim 7, wherein the filled opening, second opening and thirdopening are substantially coplanar.
 9. The method of claim 1, furthercomprising: using the etched target layer to form a conductive line ofan interconnect structure.
 10. A method of semiconductor fabrication,comprising: forming a first photoresist element on a substrate, whereinthe first photoresist element has an opening therein; filling theopening to form a filled opening; removing the first photoresist elementafter filling the opening; after filling the opening, forming a secondphotoresist element and a third photoresist element adjacent to andcoplanar with the filled opening; forming a spacer element on sidewallsof the second photoresist element and the third photoresist element;after forming the spacer elements, removing the second and thirdphotoresist elements; and using the filled opening and the spacerelements as a masking element to provide an interconnect layer of asemiconductor device.
 11. The method of claim 10, wherein using thefilled opening and the spacer elements as the masking element to providethe interconnect layer includes etching a hardmask layer throughopenings provided by the removal of the first and second photoresistelements and defined by the spacer elements.
 12. The method of claim 10,wherein the forming the spacer element on sidewalls of the secondphotoresist element and the third photoresist element, further includesforming spacer elements on sidewalls of the filled opening.
 13. Themethod of claim 12, wherein the spacer elements are disposed on foursidewalls of the filled opening.
 14. The method of claim 10, wherein theusing the filled opening and the spacer elements to provide aninterconnect layer includes etching a hard mask layer.
 15. A method,comprising: forming a first feature on a layer of a substrate using afirst patterning process; after forming the first feature, forming asecond feature and a third feature on the layer of the substrate using asecond patterning process, wherein the first feature interposes thesecond and third features and wherein a space surrounds the firstfeature; forming a conformal layer over the first, second, and thirdfeatures; etching back the conformal layer to expose a top surface ofthe first, second and third features; removing the second and thirdfeatures after exposing the top surface to form a first and secondopening; using the space, the first opening and the second opening toform trenches in an underlying layer; and using the trenches to patternan interconnect structure of a semiconductor device.
 16. The method ofclaim 15, wherein the interconnect structure is a copper metal line. 17.The method of claim 15, wherein the second and third features include aphotoresist material.
 18. The method of claim 15, wherein etching backthe conformal layer to expose the top surface of the first, second andthird features provides a planar surface including the conformal layerand each of the first, second and third features.
 19. The method ofclaim 15, further comprising: forming a fourth feature and a fifthfeature using the first patterning process, wherein the fourth featureis spaced a first distance from an end cap of the second feature and thefifth feature is spaced a second distance from an end cap of the thirdfeature, and wherein the forming the conformal layer fills region of thefirst distance and the second distance.
 20. The method of claim 19,further comprising: wherein the first feature, the fourth feature andthe fifth feature have a composition including silicon.